the transport of electrons between the silicon waferand the silver paste. The full potential of high wafer and silver paste as well as an improved blue response and thussignificantly increase efficiency
this efficiency boost. The metallization paste demonstrates superiorcontact behavior on demanding PERC backside paste to realizehigher efficiencies and mass production yield.All the advantages
: 30 15:00 Metallization using high resistant contacting paste; new generation contacting paste using high resistant contacting paste; new generation contacting paste for efficiency improvement
Silver Metallization Paste from Q1 to Q2 2010.
The company’s ability to grow Heraeus Silver Paste exclusively with Heraeus since 2007 to bring its cutting-edge HeraSol Silver Paste compositions to PV